[G] Solid process/ Solid and welding process(2)

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[313] Effects of Morphological Changes and Creep Properties on Thermal Fatigue Properties of Sn-xAg-0.5%Cu (x=1, 2, 3 and 4mass%) solder alloys.

*Shinichi TERASHIMA¹ (1. Advanced Technology Research Labs., Nippon Steel Corp.)

Keywords:

はんだ,熱疲労,クリープ,マイクロ接合,実装

Effects of Morphological Changes and Creep Properties on Thermal Fatigue Properties of Sn-xAg-0.5%Cu (x=1, 2, 3 and 4mass%) solder alloys.