Session Details

[G]Heat Resistant Materials

Fri. Sep 19, 2025 9:05 AM - 11:30 AM JST
Fri. Sep 19, 2025 12:05 AM - 2:30 AM UTC
Room Q(N303 3rd floor Building N)
座長:小林 覚(東京科学大学)、関戸信彰(東北大学)
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と招待講演は5~10分)

[362][Young Researcher Award]Creep properties of ferritic heat-resistant steel manufactured by laser powder bed fusion

*Tomotaka HATAKEYAMA1 (1. NIMS)
Comment()

[363]Microstructure and creep behavior of UNS N07001 built by electron beam melting

*Ryo Takakuwa1, Motoki Sakaguchi2, Hiroaki Nakamoto1, Manabu Noguchi1, Hirotsugu Inoue2 (1. Ebara corporation, 2. Science Tokyo)
Comment()

[364]Effects of build angle in laser powder bed fusion on mechanical properties of IN738LC

*Masahiro KUSANO1, Toshio OSADA1, Makoto WATANABE1 (1. NIMS)
Comment()

[365]Grain boundary microstructures of Inconel® 738LC laser powder bed fusion products after heat treatment

*Kosuke KUWABARA1, Masahiro KUSANO1, Toshio OSADA1, Makoto WATANABE1 (1. NIMS)
Comment()

break

[366]Toughness and creep properties in B-doped NbSi2/MoSi2 dual phase silicide

*Mitsuharu TODAI1, Koji HAGIHARA2, Takayoshi NAKANO3 (1. National Institute of Technology, Niihama College, 2. Nagoya Institute of Technology, 3. Osaka University)
Comment()

[367]Microstructure and High-Temperature Mechanical Properties of γ/γ′ Two-Phase Platinum-Group-Metal High-Entropy Alloys

*Haoran Xie1, Hideyuki Murakami3, Tatsuya Yanagidate4, Kunihiro Shima4, Yamabe-Mitarai Yoko2 (1. Utokyo(D), 2. Utokyo, 3. NIMS, 4. TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.)
Comment()

[368]Temperature dependence of mechanical properties and strengthening mechanisms in BCC refractory alloy

*Motoki Fukashiro1, Haoran Xie1, Yoko Yamabe-Mitarai2 (1. 東京大学(院生)、2. 東京大学)
Comment()

[369]Effect of Interstitial Element Additions on Microstructure and Mechanical properties of Co-Cr-Ta Ternary Alloys

*Lu JIN1, Yoko Yamabe-Mitrai2, Hideyuki Murakami3, Kazuhiko Noda4 (1. Graduate Student of The University of Tokyo, 2. The University of Tokyo, 3. NIMS, 4. Shibaura Institute of Technology)
Comment()