[P] P231~P243 Materials Processing

[P238] Joining of Metal Foil and Hard-to-bond Materials by Shot Peening

○Yasunori Harada¹, Toshinori Aoki², Takahiro Saito³ (1. Univ. of Hyogo, 2. Hyogto PIT, 3. Sanalloy)

Keywords:

shot peening,bonding,glass,ceramic,copper

Non-metallic materials such as glass and ceramics are widely used as insulators in the field of electronic components; furthermore, metal plating is often applied to these insulators. In this study, we attempted to bond metal foil to non-metallic materials using shot peening and report the results regarding the bonding characteristics.