Presentation Information
[P56]Strengthening of Electrodeposited Ag-Bi Layers: Low and High Bi Concentrations
○Changgyun Kim1,2, huiseong Ryu1, youngmin Cho1, Abrar Ahmed2, Taiki Tsuchiya2, Seungwon Lee2, Injoon Son1, Susumu Ikeno2, Kenji Matsuda2 (1. Kyungpook National University, 2. University of Toyama)
Keywords:
electrodeposited Ag-Bi layer,Strengthening mechanisms,TEM,Twin,Stacking faults
This study elucidates strengthening mechanisms in electrodeposited Ag-Bi layers using TEM. Hardness increased at both low and high Bi levels. High Bi samples showed grain boundary Bi segregation, while low Bi samples exhibited twins and stacking faults, enhancing hardness.
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