[16p-C43-1~12] 1.5 Instrumentation, measurement and Metrology

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)

[16p-C43-11] Development of Non-destructive Two-dimensional Monitoring Method for Adhesive Curing Process

〇Yasuto Fujimaki¹, Miyuki Kosugi¹, Jun Inoue¹, Shinichi Tomiyama¹ (1.TIRI)

Keywords:

Adhesive,Non-destructive,Monitoring

Adhesive bonding is often used to bond resin parts. However, once bonded, it is not possible to observe the cured state of the adhesive from the outside. In this study, we developed a new imaging method that utilizes the scattering phenomenon of near-infrared light in order to non-destructively monitor the behavior of adhesives when bonding resin parts.