Presentation Information

[18p-B5-7]Room Temperature Bonding with In/Nb Bumps

〇(M1)Shoei Ishiyama1,2, Masahisa Fujino2, Hiroshi Nakagawa2, Yuuki Araga2, Katsuya Kikuchi2, Tohru Taino1 (1.Saitama Univ., 2.AIST)
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Keywords:

Superconducting Devices,Room temperature bonding


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