[18p-B5-1~15] 11.4 Analog applications and their related technologies

2:45 PM - 3:00 PM JST(5:45 AM - 6:00 AM UTC)

[18p-B5-7] Room Temperature Bonding with In/Nb Bumps

〇(M1)Shoei Ishiyama^1,2, Masahisa Fujino², Hiroshi Nakagawa², Yuuki Araga², Katsuya Kikuchi², Tohru Taino¹ (1.Saitama Univ., 2.AIST)

Keywords:

Superconducting Devices,Room temperature bonding