[18p-B5-1~15] 11.4 Analog applications and their related technologies

3:00 PM - 3:15 PM JST(6:00 AM - 6:15 AM UTC)

[18p-B5-8] Uniformity of Bonding Load by Modifying Nb Bump Arrangement for 3D Mounted Superconductor Devices

〇Mizuki Homma¹, Masahisa Fujino², Hiroshi Nakagawa², Yuuki Araga², Katsuya Kikuchi², Tohru Taino¹ (1.Saitama Univ., 2.AIST)

Keywords:

superconductivity,bonding