JSAP24aWP_SCREEN01.gif

24a_SCREEN

JSAP24aWP_SSS.gif

24a_SonySemicon

JSAP24aWP_NIMS.gif

JSAP24a_NIMS

JSAP24aWP_Rohm.gif

JSAP24a_Rohm

General information

Announcements(7)

Official HP

Schedule

Schedule by Category

Schedule by Room

Program

Sessions

Search presentations

Extended Abstracts Download

Timetable

Mon. Sep 16, 2024

Tue. Sep 17, 2024

Wed. Sep 18, 2024

Thu. Sep 19, 2024

Fri. Sep 20, 2024

Exhibition

JSAP EXPO

Vacuum

Materials

Photonics

Laser

Analytics

Thin-Film

Electrical

Chiller

Software

M＆BE

Books & Publisher

Other

Career

Convention Bureau

24A_1000×100egl.jpg

web_icon.png

Profile management

Announcements

Bookmark

Download PDF for print

Presentation type

Highlighted Presentation

Presentation by Applicant for JSAP Young Scientists Presentation Award

English Presentation

Change account information such as the email address and password on the account setting screen common to Confit.

Log in to make the most of the service, such as bookmark registration.

Login required to view

Password required to view

Presentation Information

Session Details

To browse or post comments, you must log in.

You cannot post comments as it is outside the comment posting period.

This comment has been deleted. You cannot reply to this comment.

Design the Future -Semiconductor Bonding Technology and Potentiality-

Symposium Sponsor<br><a title="SSS" href="https://www.sony-semicon.com/ja/index.html" target="_blank" rel="noopener"><img src="https://meeting.jsap.or.jp/jsapm/wp-content/uploads/2024/08/NT3_SonySemiconductor.png" alt="Sony Semicondutor Solutions" width="310" height="39" /></a>

(Open Symposium) Create the Future by Yourself! - New World Developed by Semiconductors

The 85th JSAP Autumn Meeting 2024

Presentation Information

[19a-A22-5]Design the Future -Semiconductor Bonding Technology and Potentiality-

Keywords:

Comment