[8a-E217-1~7] 9.5 New functional materials and new phenomena

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)

[8a-E217-4] Preliminary Study on the Fabrication of High-Diamond-Content Cu-Diamond Composites Using Ultra-High-Pressure SPS

〇YOSHIHISA Mori¹, Kengo Suzuki² (1.Okayama Univ. of Sci, 2.Space Seed Holdings)

Keywords:

Cu-diamond composites,Ultra-high-pressure spark plasma sintering,High-pressure synthesis

Cu–diamond composites are regarded as promising heat dissipation materials for power semiconductor packaging because of their high thermal conductivity and low thermal expansion. In this study, we attempted to rapidly fabricate high-diamond-content Cu–diamond composites at low temperatures using a clamp-type ultra-high-pressure SPS apparatus. As a result, a specimen containing 40 vol% diamond was successfully recovered under conditions of an estimated pressure of 2 GPa or higher, 700 °C, and a holding time of 5 min. The proposed method is also expected to improve the experimental throughput of high-pressure materials exploration.