[8p-S2-1~11] Innovating Photonics-Electronics Convergence Technologies for AI Data Centers: Systems, Devices, Materials, and Integration Processes

4:00 PM - 4:30 PM JST(7:00 AM - 7:30 AM UTC)

[8p-S2-7] Future perspective on optical modulation technologies in the age of co-packaged optics

〇Mitsuru Takenaka¹ (1.Univ. of Tokyo)

Keywords:

Si photonics,Co-packaged optics,Heterogeneous material integration

In recent years, intensive research and development efforts have been devoted to co-packaged optics, in which optical transceiver chips are integrated in close proximity to LSIs to enable optical input/output, and the realization of high-speed and compact optical modulators has become a key enabling technology. Looking further ahead, optical circuit and packet switches based on optical switching technologies, as well as photonic computing circuits and optical memories, are also expected to be introduced. In this presentation, we review the current status and future prospects of optical modulation technologies being developed on Si photonics platforms, highlighting our recent research achievements.