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[III-215] Development of High-Performance Backfill Injection Material

Takuto Nakayama¹, *Tanaka Yuuichi¹, Kenji Mito², Takeshi Kuzuma³, Hiroaki Ishii⁴, Yoshinori Shioi⁵ (1. Toda Corporation Co., Ltd., 2. Nishimatsu Construction Co., Ltd., 3. Nippon Civic Consulting Engineers Co., Ltd., 4. Tachibana Material Co., Ltd., 5. Kao Corporation Co., Ltd.)

Keywords:

Shield TBM,Backfill Injection Material,Large Diameter,Great Depth,Tertiary Layer