Presentation Information

[E2-O301-01]Grain Boundary Strength and Its Degradation of High Thermal Conductivity Silicon Nitride Ceramics

*Junichi Tatami Tatami1, Komaki Matsuura1, Motoyuki Iijima1, Takuma Takahashi2, Hiromi Nakano3, Tatsuki Ohji1 (1. Yokohama National Univ. (Japan), 2. Kanagawa Inst. of Indus. Sci. and Tech. (Japan), 3. Toyohashi Univ. Tech. (Japan))

Keywords:

Grain boundary,Strength,Microcantilever bending,Silicon Nitride,Fatigue