Presentation Information

[H3-O301-03]Dissimilar material sintering driving force of the Ag/Cu interface beyond the grain boundary diffusion

*Byeongchan Kim1,2, YehRi Kim1,2, Dongjin Kim1 (1. Korea institue of industrial Tech (Korea), 2. Korea Univ (Korea))

Keywords:

Grain boundary diffusion,bonding strength,silver sintering