Presentation Information
[H3-O301-03]Dissimilar material sintering driving force of the Ag/Cu interface beyond the grain boundary diffusion
*Byeongchan Kim1,2, YehRi Kim1,2, Dongjin Kim1 (1. Korea institue of industrial Tech (Korea), 2. Korea Univ (Korea))
Keywords:
Grain boundary diffusion,bonding strength,silver sintering
