Presentation Information
[H3-P103-08]Simultaneous multi-layer Ag sintering for Double-Side Cooled SiC Power Modules
*Junha Baik1, YehRi Kim1,2, Byeongchan Kim1,2, Dongjin Kim1,Ha-Young Yu1 (1. Korea institue of industrial Tech (Korea), 2. Korea Univ (Korea))
Keywords:
Silver sintering,double-side cooled (DSC) SiC power modules,multi-layer bonding,thermal interface design