Presentation Information
[H3-P103-09]Large-area Heat Sink Bonding for Power Modules using Micro Hole-pin Structure
*Junwoo Park1, Shin-Il Kim1,2, Byeongchan Kim1,2, Dongjin Kim1 (1. Korea Institute of Industrial Technology (KITECH) (Korea), 2. Korea univ. (Korea))
Keywords:
Power Modules,Large-area Heat Sink,Heat Dissipation