[MF3] Integrated Photonic Circuits and Platforms I

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[MF3-4] Integration Methods for Co-Packaged Optics using SiN-to-Polymer Waveguide Coupling

○Jef Van Asch^1,2, Jeroen Missinne¹, Junwen He^2,3, Arnita Podpod², Guy Lepage², Negin Golshani², Rafal Magdziak², Huseyin Sar², Hakim Kobbi², Swetanshu Bipul², Dieter Bode², Yoojin Ban², Filippo Ferraro², Joris Van Campenhout², Geert Van Steenberge¹ (1. Centre for Microsystems Technology (CMST), imec and Ghent University (Belgium), 2. Imec (Belgium), 3. Currently at Huawei Technologies (China))

Keywords:

Photonics-Electronics integration,Photonic integrated circuits,Packaging technology of photonic devices and circuits,Tapered and grating waveguides for optical coupling,Si photonic and heterogeneous platform

We present broadband silicon-nitride to polymer waveguide adiabatic coupling interfaces with sub-1 dB loss around 1310 nm, validated using two integration methods: lithography and flip-chip bonding, achieving sub-2 dB chip-to-chip and chip-to-fiber coupling loss.