Presentation Information
[TuD1-1]High-Speed EML and Packaging Technologies for GPU Cluster System
○Mizuki Shirao1, Shinya Okuda1, Takuma Fujita1, Nobuo Ohata1 (1.Mitsubishi Electric Corporation)
This paper presents the current development status of the EML chip, aiming to achieve 400 Gbps per lane, as well as the progress in packaging technologies, which are crucial for high-speed and high-density modules.