Presentation Information
[TuD1-1]High-Speed EML and Packaging Technologies for GPU Cluster System
○Mizuki Shirao, T. Nagamine, Shinya Okuda, Takuma Fujita, Nobuo Ohata (Mitsubishi Electric Corporation)
This paper presents the current development status of the EML chip, aiming to achieve 400 Gbps per lane, as well as the progress in packaging technologies, which are crucial for high-speed and high-density modules.