[WG1] Advanced Lasers III

9:00 AM - 9:30 AM JST(12:00 AM - 12:30 AM UTC)Invited

[WG1-1] Next-generation Heterogeneously Integrated Lasers and PICs on Silicon for AI Applications

○Songtao Liu¹ (1. Intel (United States of America))

In this presentation, I will explore Intel’s latest advancements in heterogeneously integrated lasers and photonic integrated circuit (PIC) technology on a 300 mm silicon platform. These innovations are paving the way for scalable, high-performance optical I/O solutions tailored to the growing demands of AI.