[WP-E] Poster Session 2

[WP-E-6] An On-Chip High-Order Mode Converter Based On 2.2-μm-Thick SOI Platform

Xiyue Lyu¹, ○Bingzhou Hong², Fangchen Hu², Yaotian Zhao², Yiheng Zhao², Haiwen Cai², Wei Chu² (1. Fudan University (China), 2. Zhangjiang Laboratory (China))

Keywords:

Optical demultiplexers,Photonic integrated circuits,Advanced passive devices

We proposed an on-chip TE₀₁ - TE₂₂ mode converter on 2.2-µm-thick SOI platform with 0.3 dB insertion loss. Such device is expected to act a chip-to-fiber LP mode converter for MDM applications.