OECC/PSC 2025

Organizers: Mizuki Shirao (Mitsubishi Electric Corporation), Patrick Lo (Advanced Micro Foundry Pte Ltd)

The integration of photonics and electronics, whether through monolithic like System-on-Chip or via advanced packaging as System-in-package, has become critically important. This convergence plays an indispensable role in enabling modern AI and machine learning technologies. The synergetic integration of photonics and electronics finds unique applications in areas such as information processing, intelligent perception, automatic control, and optical computing. Once a subject of heavy debate, the inevitability of this technology is now widely acknowledged, therefore as reflected in the title of this workshop. The goal of this workshop is to explore and try to answer the questions of “how”, “what” and “when” of this evolution and identify key drivers to transform these advancements from concepts to realities through a global collaborative effort.

This workshop will address core topics, e.g.,:

・End-User Applications and Market Insights: Major applications driving industry needs.
・Core Process and Design Technologies: Strategies for implementation.
・Innovative Materials and Integration Strategies: Scaling beyond silicon’s capabilities.
・Advanced Packaging Technologies: Scaling out with higher I/O density in “ocean” or “shoreline” configurations.
・New Design Tools: Tackling challenges and exploring opportunities.
・Readiness of the service providers: including Wafer Fabrication, Ensuring a coordinated framework to support these efforts.