ALPS Poster Session 1

[ALPSp1-02] Non-Defective Tungsten/Copper Bonding via Laser Surface Modification for Plasma Facing Material Applications

*Hiyori Uehara^1,2, Haotian Yang², Ryo Yasuhara^1,2, Daisuke Nagata¹, Masayuki Tokitani^1,2, Tomoki Tanaka³, Takahiro Fujita³, Keita Suzuki⁴, Haruki Kawaguchi^1,2, Chihiro Suzuki^1,2, Reina Miyagawa^1,5, Hiroyuki Noto^1,2 (1. National Institute for Fusion Science, 2. SOKENDAI, 3. Nippon Tungsten Co.,Ltd., 4. Hokkaido Univ., 5. NITech)

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