Presentation Information
[ALPSp1-02]Non-Defective Tungsten/Copper Bonding via Laser Surface Modification for Plasma Facing Material Applications
*Hiyori Uehara1,2, Haotian Yang2, Ryo Yasuhara1,2, Daisuke Nagata1, Masayuki Tokitani1,2, Tomoki Tanaka3, Takahiro Fujita3, Keita Suzuki4, Haruki Kawaguchi1,2, Chihiro Suzuki1,2, Reina Miyagawa1,5, Hiroyuki Noto1,2 (1. National Institute for Fusion Science, 2. SOKENDAI, 3. Nippon Tungsten Co.,Ltd., 4. Hokkaido Univ., 5. NITech)