Session Details

Printing & bonding

Thu. Apr 24, 2025 3:30 PM - 5:00 PM JST
Thu. Apr 24, 2025 6:30 AM - 8:00 AM UTC
315 (Conference Center)
Session Chair: Hideho Odaka (RIKEN SPring-8 Center, RIKEN, Japan)

[TILA-LIC7-01(Invited)]Tiny integrated nanolaser innovations through transfer printing techniques

*Myung-Ki Kim1 (1. Korea University, Korea)

[TILA-LIC7-02]Phonon-Mediated Superconducting Particle Detectors using Surface Activated Bonding Technology for Microchip Lasers

*Ryota Ito1,2, Yuto Kamei2, Takunori Taira3, Hideho Odaka3, Toru Taino4, Satoru Mima5, Chiko Otani1,2 (1. Tohoku University, 2. RIKEN, 3. IMS, 4. Saitama University, 5. NICT)

[TILA-LIC7-03]Surface Smoothing Based on Polyimide/PDMS Template Stripping for Low-Temperature Bonding of Heat Dissipating Ceramics

*Shintaro Goto1, Shogo Koseki1, Kai Takeuchi1, Eiji Higurashi1 (1. Tohoku University)

[TILA-LIC7-04]Analysis of the plasma with intermediate optical thickness for laser-induced breakdown spectroscopy

*Tetsuo Sakka1, Masashi Shintani1, Yuko Yokoyama1, Naoya Nishi1 (1. Kyoto University)

[TILA-LIC7-05]Investigation of thermal properties of Cr:LiSAF/Sapphire bonded materials

*Florent Cassouret1, Yoichi Sato2,1, Takunori Taira2,1 (1. Institute for Molecular Science, 2. RIKEN SPring-8 center)