[TILA-LIC10] Bonding technology | OPTICS & PHOTONICS International Congress 2026

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Session Details

TILA-LIC2026 : Oral Presentation

Bonding technology

Thu. Apr 23, 2026 1:30 PM - 3:00 PM JST
Thu. Apr 23, 2026 4:30 AM - 6:00 AM UTC

315 (Pacifico Yokohama Conference Center)

Session Chair: Nicolaie Pavel (INFLPR, Romania)

1:30 PM - 2:00 PM JST(4:30 AM - 5:00 AM UTC)

[TILA-LIC10-01(Invited)]Fabrication of quasi-phase-matched GaAs and ZnSe multiple-plate stacks for infrared wavelength conversion via room-temperature bonding

*Ichiro SHOJI¹ (1. Chuo University)

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2:00 PM - 2:30 PM JST(5:00 AM - 5:30 AM UTC)

[TILA-LIC10-02(Invited)]Distributed Face Cooling Laser Gain Medium by Gradient Ceramic Interlayer Bonding

Xue Han¹, Zongkun Wang¹, Hong Lei^1,2,3,4, Zhanda Zhu^1,2,3,4, *Qiang LI^1,2,3,4 (1. Beijing University of Technology, 2. Key Laboratory of Trans-scale Laser Manufacturing Technology, 3. Beijing Engineering Research Center of Laser Technology, 4. Beijing Higher Institution Engineering Research Center of Advanced Laser Manufacturing)

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2:30 PM - 2:45 PM JST(5:30 AM - 5:45 AM UTC)

[TILA-LIC10-03]Bonding interface analysis and thermal properties of Cr:LiSAF and sapphire composite materials

*Florent Cassouret¹, Yoichi Sato^2,1, Takunori Taira^2,1 (1. Institute for Molecular Science, 2. RIKEN SPring-8 center)

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2:45 PM - 3:00 PM JST(5:45 AM - 6:00 AM UTC)

[TILA-LIC10-04]2.2 mJ, 1 kHz picosecond laser based on 4-passes DFC amplifier

Florent Cassouret¹, *Tirumalasetty Panduranga Mahesh¹, Baptiste Bruneteau¹, Takuya Matsubara¹, Sylvain de Leseleuc^1,2, Kenji Ohmori^1,3, Takunori Taira^4,1 (1. Institute for Molecular Science, 2. RIKEN center for Quantum Computing, 3. SOKENDAI, 4. RIKEN SPring-8 center)

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