Presentation Information

[PL-03]From Atom to System: Multi-scale Thermal, Mechanical, and Reliability Modeling of Advanced Packages for AI 

*Xi-Wei Lin1,  Ti-Yung Lan2, Kelly Morgan1, Xiaopeng Xu1, Soren Smidstrup3, Julian Schneider3 (1. Synopsys Inc., 2. Synopsys Taiwan, 3. Synopsys Denmark)

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