Presentation Information
[PL-03]From Atom to System: Multi-scale Thermal, Mechanical, and Reliability Modeling of Advanced Packages for AI
*Xi-Wei Lin1, Ti-Yung Lan2, Kelly Morgan1, Xiaopeng Xu1, Soren Smidstrup3, Julian Schneider3 (1. Synopsys Inc., 2. Synopsys Taiwan, 3. Synopsys Denmark)
Comment
To browse or post comments, you must log in.Log in
