Presentation Information

[A-19-11]Thermal Simulation for Evaluating Thermal Side-Channel Leakage and Heat Dissipation

◎△Shuhei Yokota1, Rikuu Hasegawa1, Takuya Wadatsumi2, Kazuki Monta2, Makoto Nagata1 (1. Kobe University, 2. Secafy Co., ltd.)

Keywords:

Thermal Simulation,Thermal side-channel,Heat dissipation,Thermal Management

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