Presentation Information
[A-19-11]Thermal Simulation for Evaluating Thermal Side-Channel Leakage and Heat Dissipation
◎△Shuhei Yokota1, Rikuu Hasegawa1, Takuya Wadatsumi2, Kazuki Monta2, Makoto Nagata1 (1. Kobe University, 2. Secafy Co., ltd.)
Keywords:
Thermal Simulation,Thermal side-channel,Heat dissipation,Thermal Management
