1989 Conference on Solid State Devices and Materials
Aug 28 - Aug 30, 1989Nippon Toshi Center, Tokyo, Japan
1989 Conference on Solid State Devices and Materials
Aug 28 - Aug 30, 1989Nippon Toshi Center, Tokyo, Japan
[A-1-4]Thermal Stability Studies on Copper Thin Films Formed by a Low-Kinetic-Energy Particle Process
Tatsuyiki Saito, Tadahiro Ohmi, Tadashi Shibata, Masahito Otsuki, Takahisa Nitta(1.Department of Electronics, Faculty of Engineering Tohoku University, 2.Device Development Center, Hitachi Ltd.)
