International Conference on Solid State Devices and Materials
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1989 Conference on Solid State Devices and Materials
Aug 28
- Aug 30, 1989
Nippon Toshi Center, Tokyo, Japan
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1989 Conference on Solid State Devices and Materials
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1989 Conference on Solid State Devices and Materials
Aug 28
- Aug 30, 1989
Nippon Toshi Center, Tokyo, Japan
[A-5-4]
Low Leakage SOIMOSFETs Fabricated Using a Wafer Bonding Method
M. Hashimoto, A. Ogasawara, M. Shimanoe, A. Nieda, H. Satoh, A. Yagi, T. Matsushita(1.Research & Development Div., Semiconductor Group Sony Corp)
https://doi.org/10.7567/SSDM.1989.A-5-4
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