1995 International Conference on Solid State Devices and Materials
Aug 21 - Aug 24, 1995International House, Osaka, Japan
1995 International Conference on Solid State Devices and Materials
Aug 21 - Aug 24, 1995International House, Osaka, Japan
[S-IV-10]Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs
G. Minamihaba, Y. Shimooka, H. Tamura, T. Iijima, T. Kawanoue, H. Hirabayashi, N. Sakurai, H. Ookawa, T. Obara, H. Egawa, T. Idaka, T. Kubota, T. Shimizu, M. Koyama, G. Ooshima, K. Suguro(1.ULSI Research Laboratories, Manufacturing Engineering Research Center, Semiconductor Division, TOSHIBA Corporation)
