1995 International Conference on Solid State Devices and Materials

1995 International Conference on Solid State Devices and Materials

Aug 21 - Aug 24, 1995International House, Osaka, Japan
International Conference on Solid State Devices and Materials
1995 International Conference on Solid State Devices and Materials

1995 International Conference on Solid State Devices and Materials

Aug 21 - Aug 24, 1995International House, Osaka, Japan

[S-IV-6]Novel Low Leakage and Low Resistance Titanium Salicide Technology with Recoil Nitrogen Achieved by Silicidation after Ion Implantation through Contamination-Restrained Oxygen Free LPCVD-Nitride Layer (SICRON)

H. Kotaki, M. Nakano, S. Hayashida, T. Matsuoka, S. Kakimoto, A. Nakano, K. Uda, Y. Sato(1.Central Research Laboratories, Sharp Corporation, 2.Analysis Center, (IC) Group, Sharp Corporation)
https://doi.org/10.7567/SSDM.1995.S-IV-6