1995 International Conference on Solid State Devices and Materials
Aug 21 - Aug 24, 1995International House, Osaka, Japan
1995 International Conference on Solid State Devices and Materials
Aug 21 - Aug 24, 1995International House, Osaka, Japan
[S-IV-8]In Situ Study of Electromigration in Submicron-Wide Layered Al-0.5%Cu Lines by Side-View TEM Observation
Hidekazu OKABAYASHI, Masao KOMATSU, Hirotaro MORI(1.Research and Development Group, NEC Corp., 2.Research Center for Ultra-High Voltage Electron Microscopy, Osaka University)
