International Conference on Solid State Devices and Materials
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1995 International Conference on Solid State Devices and Materials
Aug 21
- Aug 24, 1995
International House, Osaka, Japan
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1995 International Conference on Solid State Devices and Materials
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1995 International Conference on Solid State Devices and Materials
Aug 21
- Aug 24, 1995
International House, Osaka, Japan
[S-IV-9]
Copper Interconnects Fabricated by Dry Etching Process
Yasushi Igarashi, Tomomi Yamanobe, Toshio Ito(1.Semiconductor Technology Laboratory, OKI Electric Industry Co., Ltd.)
https://doi.org/10.7567/SSDM.1995.S-IV-9
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