1996 International Conference on Solid State Devices and Materials
Aug 26 - Aug 29, 1996Pacifico Yokohama, Yokohama, Japan
1996 International Conference on Solid State Devices and Materials
Aug 26 - Aug 29, 1996Pacifico Yokohama, Yokohama, Japan
[A-3-3]Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization
Takanori ICHIKI, Toshiaki KIKUCHI, Atsushi SANO, Shoso SHINGUBARA, Yasuhiro HORIIKE(1.Department of Electrical & Electronics Engineering, Toyo University, 2.Department of Electrical Engineering, Hiroshima University)
