1996 International Conference on Solid State Devices and Materials
Aug 26 - Aug 29, 1996Pacifico Yokohama, Yokohama, Japan
1996 International Conference on Solid State Devices and Materials
Aug 26 - Aug 29, 1996Pacifico Yokohama, Yokohama, Japan
[A-3-4]A Study of Via-Electromigration Failure in Multilevel Interconnection with High Temperature Sputtered Aluminum
Makiko Kageyama, Keiichi Hashimoto, Hiroshi Onoda(1.VLSI R&D Center, Oki Electric Industry Co., Ltd.)
