2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
[A-1-5]Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
Shui Jinn Wang, Hao Yi Tsai, S. C. Sun(1.Microelectronics Lab., Dept. of Electrical Engineering, National Cheng Kung University, 2.R&D, Wafertech)
