2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
[A-2-1]Reliability and Electromigration Failure Modes in Dual Inlaid Cu Interconnects
C. Capasso, M. Herrick, M. Gall, D. Jawarani, S. Thrasher, L. Zhao, H. Kawasaki(1.Advanced Products Research and Development Laboratory DigitalDNA TM Laboratories, Motorola, 2.Technology Development Group, Advanced Micro Devices)
