2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
2000 International Conference on Solid State Devices and Materials
Aug 29 - Aug 31, 2000Sendai International Center, Sendai, Japan
[A-2-6]Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process
Soo Gun Lee, Hyeok-Sang Oh, Hong-Jae Shin, Jin-Gi Hong, Hyeon-Deok Lee, Hokyu Kang(1.Process Development Team, Semiconductor R&D center, Samsung Electronics)
