2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
[B-1-3]Electroplating Cu Filling Study for Thorough Electrode in Silicon Wafer of Three Dimensional LSI Chip Stacking
M. Tomisaka, H. Yonemura, M. Hoshino, K. Takahashi(1.Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET))
