2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
[B-1-4]Feasibility of Direct Bonding Between CMP-Cu Films at Room Temperature for Bumpless Interconnect
Akitsu Shigetou, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga(1.Research Center for Advanced Science and Technology, The University of Tokyo)
