2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
2001 International Conference on Solid State Devices and Materials
Sep 26 - Sep 28, 2001Diamond Hotel, Tokyo, Japan
[LB-1-1]Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package
Tadahiro Morifuji, Yoshihiro Tomita, Ryoichi Kajiwara, Kenji Takahashi(1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center Room C-B-5, Tsukuba Center Inc.)
