2002 International Conference on Solid State Devices and Materials
Sep 17 - Sep 19, 2002Nagoya Congress Center, Nagoya, Japan
2002 International Conference on Solid State Devices and Materials
Sep 17 - Sep 19, 2002Nagoya Congress Center, Nagoya, Japan
[B-2-1]ADHESION AND RELIABILITY IN THIN-FILM STRUCTURES CONTAINING CU AND LOW K MATERIALS: EXPERIMENTS AND MULTI-SCALE SIMULATIONS
Reinhold H. Dauskardt(1.Department of Materials Science and Engineering Stanford University)
