2002 International Conference on Solid State Devices and Materials
Sep 17 - Sep 19, 2002Nagoya Congress Center, Nagoya, Japan
2002 International Conference on Solid State Devices and Materials
Sep 17 - Sep 19, 2002Nagoya Congress Center, Nagoya, Japan
[B-2-4]Low-cost Cu Interconnects Using Direct Patterning Process (DPP) of Photo-sensitive MSZ with Low-k, Bottom Anti-reflective layer
Munehiro Tada, Takashi Ogura, Yoshihiro Hayashi(1.Silicon Systems Research Laboratories, NEC Corporation)
