2004 International Conference on Solid State Devices and Materials

2004 International Conference on Solid State Devices and Materials

Sep 14 - Sep 17, 2004Tower Hall Funabori, Tokyo, Japan
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International Conference on Solid State Devices and Materials
2004 International Conference on Solid State Devices and Materials

2004 International Conference on Solid State Devices and Materials

Sep 14 - Sep 17, 2004Tower Hall Funabori, Tokyo, Japan

[B-2-2]Interface Adhesion and Phase Formation in Cu Interconnect

J. Koike, A. Sekiguchi, M. Wada(1.Dept. of Materials Science, Tohoku University)
https://doi.org/10.7567/SSDM.2004.B-2-2
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