2005 International Conference on Solid State Devices and Materials
Sep 12 - Sep 15, 2005International Conference Center Kobe, Kobe, Japan
2005 International Conference on Solid State Devices and Materials
Sep 12 - Sep 15, 2005International Conference Center Kobe, Kobe, Japan
[B-1-3]Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies
A. Wei, T. Kammler, J. Hontschel, H. Bierstedt, J.-P. Biethan, A. Hellmich, K. Hempel, J. Klais, G. Koerner, M. Lenski, T. Mantei, A. Neu, R. Otterbach, C. Reichel, B. Trui, G. Burbach, T. Feudel, P. Javorka, C. Schwan, N. Kepler, H.-J. Engelmann, C. Ziemer-Popp, O. Herzog, D. Greenlaw, M. Raab, R. Stephan, M. Horstmann, P.-O. Hansson, A. Samoilov, E. Sanchez, O. Luckner, S. Weiher-Telford(1.AMD Saxony LLC & Co., 2.Applied Materials, Inc., 3.Buchenstr.)
