2005 International Conference on Solid State Devices and Materials

2005 International Conference on Solid State Devices and Materials

Sep 12 - Sep 15, 2005International Conference Center Kobe, Kobe, Japan

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International Conference on Solid State Devices and Materials
2005 International Conference on Solid State Devices and Materials

2005 International Conference on Solid State Devices and Materials

Sep 12 - Sep 15, 2005International Conference Center Kobe, Kobe, Japan

You can search for presentations in this event.

Search

Search Results(533)

[A-1-3]Extendibility of High Mobility HfSiON Gate Dielectrics

Seiji Inumiya, Takayoshi Miura, Kiyoshi Shirai, Takeo Matsuki, Kazuyoshi Torii, Yasuo Nara(1.Semiconductor Leading Edge Technologies, Inc. (Selete), 2.Hitachi, Ltd., Central Research Laboratory)

[A-2-5]Improvement in the asymmetric Vfb shift of poly-Si/HfSiON/Si by inserting oxygen diffusion barrier layers into the interfaces

Yuuichi Kamimuta, Masato Koyama, Tsunehiro Ino, Katsuyuki Sekine, Motoyuki Sato, Kazuhiro Eguchi, Mariko Takayanagi, Mitsuhiro Tomita, Akira Nishiyama(1.Advanced LSI Technology Laboratory, Corporate R&D Center, Toshiba Corporation, 2.Process & Manufacturing Engineering Center, Toshiba Corporation Semiconductor Company, 3.SoC Research & Development Center, Toshiba Corporation Semiconductor Company)

[A-3-1]Dielectric Constant Behavior of Hf-O-N System

Tsunehiro Ino, Yuuichi Kamimuta, Masamichi Suzuki, Masato Koyama, Akira Nishiyama(1.Advanced LSI Technology Laboratory, Corporate Research and Development Center, TOSHIBA Corporation)

[A-3-3]Thermal Stability Improvements for HfO2 by Fluorine Implantation

Chao Sung Lai, Woei Cherng Wu, Jer Chyi Wang, Tian Sheng Chao(1.Department of Electronic Engineering, Chang Gung University, 2.Department of Electronic Physics, National Chiao Tung University, 3.Nanya Technology Corporation)

[A-4-1]Nanoscale Observations for Degradation Phenomena in SiO2 and High-k Gate lnsulators Using Conductive-Atomic Force Microscopy

Shigeaki Zaima, Akiyoshi Seko, Yukihiko Watanabe, Toshifumi Sago, Mitsuo Sakashita, Hiroki Kondo, Akira Sakai, Masaki Ogawa(1.Graduate School of Engineering, Nagoya University, 2.Toyota Central R&D Labs., Inc., 3.Center for Cooperative Research in Advanced Science&Technology, Nagoya University)

[A-4-4]Characterization of Novel HfTiO Gate Dielectrics Post-treated by NH3 Plasma and Ultra-violet Rays

Jer Chyi Wang, Woei Cherng Wu, Chao Sung Lai, Jam Wem Lee, Kuo Cheng Chiang, De Ching Shie, Tan Fu Lei, Chung Len Lee(1.Nanya Technology Corporation, 2.Department of Electronic Physics, National Chiao Tung University, 3.Department of Electronics Engineering, Chang Gung University, 4.National Nano Device Laboratories, 5.Department of Electronics Engineering, National Chiao Tung University)

[A-5-1]Thermal Degradation of HfSiON Dielectrics Caused by TiN Gate Electrodes and Its Impact on Electrical Properties

Heiji Watanabe, Shiniti Yoshida, Yasumasa Watanabe, Takayoshi Shimura, Kiyoshi Yasutake, Yasushi Akasaka, Yasuo Nara, Kunio Nakamura, Keisaku Yamada(1.Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2.Semiconductor Leading Edge Technologies, Inc., 3.Nanotechnology Research Laboratories, Waseda University)

[A-8-4]Low temperature divided CVD technique for TiN metal gate electrodes of p-MISFETs

Shinsuke Sakashita, Kenichi Mori, Kazuki Tanaka, Masaharu Mizutani, Masao Inoue, Shinichi Yamanari, Jiro Yugami, Hiroshi Miyatake, Masahiro Yoneda(1.Process Development Dept., Process Technology Development Div., Production and Technology Unit, Renesas Technology Corporation, 2.Process Engineering Section, Wafer Process Engineering Dept., Renesas Semiconductor Engineering Corporation)

[A-9-2]Thermally Robust Y2O3/Ge MOS Capacitors

Hideyuki Nomura, Koji Kita, Kentaro Kyuno, Akira Toriumi(1.Department of Materials Engineering, School of Engineering, The University of Tokyo)

[B-1-2]A 90nm Hybrid SOI CMOS Technology Integrating PDSOI and Bulk Devices for Bulk-designed MPU Performance Booster

S. Miyake, T. Suzuki, T. Watanabe, O. Fujita, N. Harada, K. Doumeki, T. Fukai, T. Syo, T. Moriya, S. Haruta, Y. Takeshita, M. Ikeda, K. Imai(1.Advanced Device Development Division, 2.Product Engineering Division, 3.Process Technology Division and, 4.Custom LSI Division NEC Electronics Corporation)

[B-1-3]Combining Embedded and Overlayer Compressive Stressors in Advanced SOI CMOS Technologies

A. Wei, T. Kammler, J. Hontschel, H. Bierstedt, J.-P. Biethan, A. Hellmich, K. Hempel, J. Klais, G. Koerner, M. Lenski, T. Mantei, A. Neu, R. Otterbach, C. Reichel, B. Trui, G. Burbach, T. Feudel, P. Javorka, C. Schwan, N. Kepler, H.-J. Engelmann, C. Ziemer-Popp, O. Herzog, D. Greenlaw, M. Raab, R. Stephan, M. Horstmann, P.-O. Hansson, A. Samoilov, E. Sanchez, O. Luckner, S. Weiher-Telford(1.AMD Saxony LLC & Co., 2.Applied Materials, Inc., 3.Buchenstr.)

[B-1-4]Effect of Process Induced Strain in 35 nm FDSOI Devices with Ultra-Thin Silicon Channels

C. Gallon, C. Fenouillet-Beranger, S. Denorme, F. Boeuf, V Fiori, N. Loubet, T. Kormann, M. Broekaart, P. Gouraud, F. Leverd, G. Imbert, C. Chaton, C. Laviron, L. Gabette, F. Vigilant, P. Garnier, H. Bernard, A. Tarnowka, A. Vandooren, R. Pantel, F. Pionnier, S. Jullian, S. Cristoloveanu, T. Skotnicki(1.STMicroelectronics, 2.Philips, 3.Freescale Semiconductors, 4.CEA-LETI, 5.IMEP)

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