2006 International Conference on Solid State Devices and Materials
Sep 12 - Sep 15, 2006PACIFICO Yokohama, Yokohama, Japan
2006 International Conference on Solid State Devices and Materials
Sep 12 - Sep 15, 2006PACIFICO Yokohama, Yokohama, Japan
[A-3-5]MEMS Wafer Level Packaging by Using Surface Activated Bonding
Yoshiyuki Takegawa, Toru Baba, Takafumi Okudo, Yuji Suzuki(1.EMIT Devices Development Department, 2.Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.)
