2007 International Conference on Solid State Devices and Materials

2007 International Conference on Solid State Devices and Materials

Sep 18 - Sep 21, 2007Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan
International Conference on Solid State Devices and Materials
2007 International Conference on Solid State Devices and Materials

2007 International Conference on Solid State Devices and Materials

Sep 18 - Sep 21, 2007Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[A-3-4]nMOSFET Reliability Improvement attributed to the Interfacial Dipole formed by La Incorporation in HfO2

C. Y. Kang, P. Kirsch, D. Heh, C. Young, P. Sivasubramani, G Bersuker, S.C. Song, R. Choi, B. H. Lee, J. Lichtenwalner, J. S. Jur, A. I. Kingon, R. Jammy(1.IBM Assignee, 2.Dept. of Materials Science and Engineering, North Carolina State University)
https://doi.org/10.7567/SSDM.2007.A-3-4