International Conference on Solid State Devices and Materials

2013 International Conference on Solid State Devices and Materials

Sep 24 - Sep 27, 2013Hilton Fukuoka Sea Hawk, Fukuoka, Japan

International Conference on Solid State Devices and Materials

2013 International Conference on Solid State Devices and Materials

Sep 24 - Sep 27, 2013Hilton Fukuoka Sea Hawk, Fukuoka, Japan

[B-1-2]Thermal and Plasma Treatments for Improved (Sub-)1nm EOT Planar and FinFET-based RMG High-k Last Devices and Enabling a Simplified Scalable CMOS Integration Scheme

A. Veloso¹, G. Boccardi¹, L.A. Ragnarsson¹, Y. Higuchi², H. Arimura^1,3, J.W. Lee^1,3, E. Simoen¹, M.J. Cho¹, Ph.J. Roussel¹, V. Paraschiv¹, X. Shi¹, T. Schram¹, S.A. Chew¹, S. Brus¹, A. Dangol¹, E. Vecchio¹, F. Sebaai¹, K. Kellens¹, N. Heylen¹, K. Devriendt¹, H. Dekkers¹, A. Van Ammel¹, T. Witters¹, T. Conard¹, I. Vaesen¹, O. Richard¹, H. Bender¹, R. Athimulam¹, A. Thean¹, N. Horiguchi¹(1.Imec, 2.Panasonic, 3.K. U. Leuven (Belgium))

https://doi.org/10.7567/SSDM.2013.B-1-2