2014 International Conference on Solid State Devices and Materials

2014 International Conference on Solid State Devices and Materials

Sep 8 - Sep 11, 2014Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan
International Conference on Solid State Devices and Materials
2014 International Conference on Solid State Devices and Materials

2014 International Conference on Solid State Devices and Materials

Sep 8 - Sep 11, 2014Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[A-1-3]Interface Engineering in Homogeneous Barrier Modulation RRAM for 3D Vertical Memory Applications

W.L. Lai1, C.T. Chou1, C.W. Hsu1, J.C. Liu1, B. Hudec1, C.H. Ho2, W.Y. Jang2, C.H. Lin2, T.H. Hou1(1.NCTU, 2.Winbond Electronics Corp. (Taiwan))
https://doi.org/10.7567/SSDM.2014.A-1-3