2015 International Conference on Solid State Devices and Materials

2015 International Conference on Solid State Devices and Materials

Sep 27 - Sep 30, 2015Sapporo Convention Center, Sapporo, Japan
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International Conference on Solid State Devices and Materials
2015 International Conference on Solid State Devices and Materials

2015 International Conference on Solid State Devices and Materials

Sep 27 - Sep 30, 2015Sapporo Convention Center, Sapporo, Japan

[A-3-4]Suppression of Void Generation in Direct Wafer Bonding for Si High-k MOS Optical Modulators using Al2O3/HfO2 Bonding Interface

○J. H. Han1, 2, M. Takenaka1, 2, S. Takagi1, 2(1.Univ. of Tokyo, 2.JST-CREST(Japan))
https://doi.org/10.7567/SSDM.2015.A-3-4
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