2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

Sep 19 - Sep 22, 2017Sendai International Center
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International Conference on Solid State Devices and Materials
2017 International Conference on Solid State Devices and Materials

2017 International Conference on Solid State Devices and Materials

Sep 19 - Sep 22, 2017Sendai International Center

[A-7-01]The Experimental Observations of a New Dielectric-fuse Breakdown in a Bilayer-RRAM to Realize the OTP Functionality

○E. R. Hsieh1, H. W. Cheng1, Z. H. Huang1, C. H. Chuang1, C. H. Chen1, S. Chung1(1.National Chiao Tung Univ. (Taiwan))
https://doi.org/10.7567/SSDM.2017.A-7-01
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